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集成电路的封装形式
作者：未知 文章来源：网络 点击数： 更新时间：2006-12-20
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BGA Ball Grid Array |
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EBGA 680L |
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LBGA 160L |
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PBGA 217L Plastic Ball Grid Array |
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SBGA 192L |
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TSBGA 680L |
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CLCC |
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CNR Communication and Networking Riser Specification Revision 1.2 |
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CPGA Ceramic Pin Grid Array |
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DIP Dual Inline Package |
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DIP-tab Dual Inline Package with Metal Heatsink |
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FBGA |
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FDIP |
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FTO-220 |
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Flat Pack |
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HSOP-28 |
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ITO-220 |
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ITO-3P |
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JLCC |
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LCC |
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LDCC |
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LGA |
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LQFP |
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PCDIP |
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PGA Plastic Pin Grid Array |
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PLCC |
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PQFP |
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PSDIP |
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LQFP 100L |
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METAL QUAD 100L |
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PQFP 100L |
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QFP Quad Flat Package |
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SOT143 |
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SOT220 |
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SOT223 |
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SOT223 |
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SOT23 |
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SOT23/SOT323 |
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SOT25/SOT353 |
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SOT26/SOT363 |
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SOT343 |
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SOT523 |
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SOT89 |
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SOT89 |
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Socket 603 Foster |
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LAMINATE TCSP 20L Chip Scale Package |
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TO252 |
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TO263/TO268 |
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QFP Quad Flat Package |
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TQFP 100L |
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SBGA |
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SC-70 5L |
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SDIP |
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SIP Single Inline Package |
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SO Small Outline Package |
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SOJ 32L |
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SOJ |
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SOP EIAJ TYPE II 14L |
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SOT220 |
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SSOP 16L |
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TO247 |
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SSOP |
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TO18 |
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TO220 |
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TO264 |
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TO3 |
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TO5 |
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TO52 |
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TO71 |
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TO72 |
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TO78 |
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TO8 |
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TO92 |
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TO93 |
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TO99 |
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TSOP Thin Small Outline Package |
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TSSOP or TSOP II Thin Shrink Outline Package |
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uBGA Micro Ball Grid Array |
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uBGA Micro Ball Grid Array |
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ZIP Zig-Zag Inline Package |
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BQFP132 |
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C-Bend Lead |
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CERQUAD Ceramic Quad Flat Pack |
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Ceramic Case |
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LAMINATE CSP 112L Chip Scale Package |
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Gull Wing Leads |
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PDIP |
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PLCC |
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SNAPTK |
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SNAPTK |
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